Power chips are attached to outside circuits with product packaging, and their performance relies on the assistance of the product packaging. In high-power situations, power chips are usually packaged as power components. Chip interconnection describes the electric connection on the top surface area of the chip, which is usually light weight aluminum bonding cable in standard components. ^
Conventional power component plan cross-section

Today, industrial silicon carbide power modules still primarily use the product packaging technology of this wire-bonded standard silicon IGBT component. They deal with problems such as huge high-frequency parasitical parameters, not enough warmth dissipation capability, low-temperature resistance, and inadequate insulation strength, which limit using silicon carbide semiconductors. The screen of exceptional performance. In order to resolve these issues and fully exploit the huge possible advantages of silicon carbide chips, several brand-new product packaging modern technologies and remedies for silicon carbide power components have actually emerged in the last few years.

Silicon carbide power module bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually developed from gold cable bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually developed from gold wires to copper cords, and the driving pressure is expense decrease; high-power devices have developed from aluminum cords (strips) to Cu Clips, and the driving force is to boost product efficiency. The higher the power, the higher the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to connect chips and pins. Compared to typical bonding product packaging techniques, Cu Clip technology has the following benefits:

1. The link between the chip and the pins is made of copper sheets, which, to a particular level, replaces the conventional wire bonding technique between the chip and the pins. Consequently, an unique package resistance value, higher existing circulation, and much better thermal conductivity can be obtained.

2. The lead pin welding location does not need to be silver-plated, which can completely conserve the price of silver plating and bad silver plating.

3. The product appearance is totally consistent with typical products and is mainly made use of in web servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power materials, and other areas.

Cu Clip has 2 bonding approaches.

All copper sheet bonding method

Both the Gate pad and the Source pad are clip-based. This bonding approach is a lot more costly and complicated, yet it can accomplish much better Rdson and better thermal effects.

( copper strip)

Copper sheet plus cord bonding method

The source pad makes use of a Clip approach, and the Gate makes use of a Cord method. This bonding approach is slightly more affordable than the all-copper bonding approach, saving wafer area (suitable to really little gateway locations). The procedure is less complex than the all-copper bonding technique and can acquire far better Rdson and better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding kitcometals copper, please feel free to contact us and send an inquiry.

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